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IEC 61189-11:2013 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys IEC 61189-11:2013 ED1

Publication date:   May 7, 2013

General information

60.60 Standard published   May 7, 2013

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

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PUBLISHED
IEC 61189-11:2013 ED1
60.60 Standard published
May 7, 2013