IEC 61189-1:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology IEC 61189-1:1997 ED1

Publication date:   Mar 27, 1997

Scope

This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.