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IEC 61188-6-4:2019 ED1

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design IEC 61188-6-4:2019 ED1

Publication date:   May 2, 2019

General information

60.60 Standard published   May 2, 2019

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

IEC 61188-6-4:2019 specifies generic requirements for dimensional drawings of SMD from the viewpoint of land pattern design.
The purpose of this document is to prevent land pattern design issues caused by lack of information and/or misuse of the information from SMD outline drawing as well as to improve the utilization of IEC 61188 series. This document is applicable to the SMD of semiconductor devices and electrical components.

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PUBLISHED
IEC 61188-6-4:2019 ED1
60.60 Standard published
May 2, 2019