Provides guidance on reliability stress screening techniques and procedures for electronic components. Is intended for use of a) component manufacturers as a guideline, b) component users as a guideline to negotiate with component manufacturers on stress screening requirements or plan a stress screening process in house due to reliability requirements, c) subcontractors who provide stress screening as a service.
WITHDRAWN
IEC 60300-3-7:1999 ED1
WITHDRAWN
IEC 61163-2:1998 ED1
99.60
Withdrawal effective
Mar 11, 2020
PUBLISHED
IEC 61163-2:2020 ED2