IEC 60749-5:2017 provides a steady-state temperature and humidity bias life test for the purpose of evaluating the reliability of non-hermetic packaged solid-state devices in humid environments. This test method is considered destructive.
This second edition cancels and replaces the first edition published in 2003. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) correction of an error in an equation;
b) inclusion of notes for guidance;
c) clarification of the applicability of test conditions.
ABANDON
IEC 60749-5/FRAGF ED2
30.97
End of interruption of work - split/merged
Sep 20, 2019
PUBLISHED
IEC 60749-5:2023 ED3