Revised
Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.
These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
WITHDRAWN
IEC PAS 62307:2002 ED1
WITHDRAWN
IEC 60749-39:2006 ED1
99.60
Withdrawal effective
Nov 29, 2021
PUBLISHED
IEC 60749-39:2021 ED2