Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.
WITHDRAWN
IEC PAS 62050:2004 ED1
WITHDRAWN
IEC 60749-37:2008 ED1
99.60
Withdrawal effective
Oct 12, 2022
PUBLISHED
IEC 60749-37:2022 ED2