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IEC 60749-35:2006 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

Publication date:   Jul 18, 2006

General information

60.60   Standard published   Jul 18, 2006

IEC

TC 47

International Standard

31.080.01   Semiconductor devices in general

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Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.

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PUBLISHED
IEC 60749-35:2006 ED1
60.60 Standard published
Jul 18, 2006