IEC 60749-30:2005+AMD1:2011 CSV ED1.1

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing IEC 60749-30:2005+AMD1:2011 CSV ED1.1

General information

99.60 Withdrawal effective   Aug 17, 2020

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IEC

TC 47 Semiconductor devices

International Standard

31.080.01   Semiconductor devices in general

Scope

IEC 60749-30:2005+A1:2011 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress).

This consolidated version consists of the first edition (2005)
and its amendment 1 (2011). Therefore, no need to order amendment in
addition to this publication.

Life cycle

NOW

WITHDRAWN
IEC 60749-30:2005+AMD1:2011 CSV ED1.1
99.60 Withdrawal effective
Aug 17, 2020

REVISED BY

PUBLISHED
IEC 60749-30:2020 ED2