0

IEC 60352-8:2011 ED1

Solderless connections - Part 8: Compression mount connections - General requirements, test methods and practical guidance IEC 60352-8:2011 ED1

Publication date:   Feb 10, 2011

General information

60.60 Standard published   Feb 10, 2011

IEC

TC 48/SC 48B

International Standard

31.220.10   Plug-and-socket devices. Connectors

Buying

Published

Language in which you want to receive the document.

Scope

IEC 60352-8:2011 Is applicable to compression mount connections with metallic spring contacts for use in telecommunication equipments and in other electronic devices employing similar techniques. Information on materials and data from industrial experience are included in addition to the test procedures to provide electrically stable connections under prescribed environmental conditions. The object of this part of IEC 60352 is to determine the suitability of compression mount connections under specified electrical, mechanical and atmospheric conditions and to provide a means of comparing test results when the tools used to make the connectors are of different designs or manufacture.

Life cycle

NOW

PUBLISHED
IEC 60352-8:2011 ED1
60.60 Standard published
Feb 10, 2011