Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions.
WITHDRAWN
IEC 60352-5:1995 ED1
WITHDRAWN
IEC 60352-5:2001 ED2
99.60
Withdrawal effective
Jan 10, 2008
WITHDRAWN
IEC 60352-5:2001/AMD1:2003 ED2
WITHDRAWN
IEC 60352-5:2008 ED3