Applies to solderless wrapped connections made with single solid round wires with nominal diameters of 0.25 mm (0.01 in) minimum and appropriately designed posts for use in telecommunications equipment and in electronic devices employing similar techniques.
Determines the suitability of solderless wrapped connections under specified mechanical, electrical and atmospheric conditions.
WITHDRAWN
IEC 60352-1:1983 ED2
99.60
Withdrawal effective
Aug 6, 1997
PUBLISHED
IEC 60352-1:1997 ED3