IEC 60317-2:2012 ED4

Specifications for particular types of winding wires - Part 2: Solderable polyurethane enamelled round copper wire, class 130, with a bonding layer IEC 60317-2:2012 ED4

Publication date:   Jul 12, 2012

Scope

IEC 60317-2:2012 specifies the requirements of solderable enamelled round copper winding wire of class 130 with a dual coating. The underlying coating is based on polyurethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. This edition includes the following significant technical changes with respect to the previous edition:
- addition of requirements for appearance, new subclause 3.3 and
- addition of pin hole test requirements, Clause 23: Pin hole test. Keywords: copper winding wire

This publication is to be read in conjunction with IEC 60317-0-1:2008.