Specifies the general requirements of enamelled round copper winding wires with or without bonding layer. This publication supersedes IEC 60182-1 (1984) and IEC 60182-2 (1987).
WITHDRAWN
IEC 60317-0-1:1990 ED1
WITHDRAWN
IEC 60317-0-1:1990/AMD1:1992 ED1
WITHDRAWN
IEC 60317-0-1:1990/AMD2:1993 ED1
WITHDRAWN
IEC 60317-0-1:1997 ED2
99.60
Withdrawal effective
Mar 11, 2008
WITHDRAWN
IEC 60317-0-1:1997/AMD1:1999 ED2
WITHDRAWN
IEC 60317-0-1:1997/AMD2:2005 ED2
WITHDRAWN
IEC 60317-0-1:2008 ED3