IEC 60249-3A:1976 ED1

First supplement: Metal-clad base materials for printed circuits - Specification No. 2: Specification for copper foil for use in the manufacture of copper clad base materials

Publication date:   Jan 1, 1976

General information

99.60 Withdrawal effective   Nov 19, 2016

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Scope

Gives requirements for properties for copper foil (electro-deposited or rolled). This supplement is still valid; it will be renumbered as 249-3-2 when revised.

Life cycle

NOW

WITHDRAWN
IEC 60249-3A:1976 ED1
99.60 Withdrawal effective
Nov 19, 2016

REVISED BY

WITHDRAWN
IEC 60249-3A ED2

PUBLISHED
IEC 61249-5-1:1995 ED1