IEC 60249-3:1973 ED1

Metal-clad base materials for printed circuits - Part 3: Special materials used in connection with printed circuits

Publication date:   Jan 1, 1973

General information

99.60   Withdrawal effective   Nov 19, 2016

IEC

TC 91

International Standard

31.180   Printed circuits and boards

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Life cycle

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WITHDRAWN
IEC 60249-3:1973 ED1
99.60 Withdrawal effective
Nov 19, 2016

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60249-3:1973/AMD1:1976 ED1