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IEC 60249-3:1973 ED1

Metal-clad base materials for printed circuits - Part 3: Special materials used in connection with printed circuits IEC 60249-3:1973 ED1

Publication date:   Jan 1, 1973

General information

99.60   Withdrawal effective   Nov 19, 2016

IEC

TC 91

International Standard

31.180   Printed circuits and boards

Buying

Revised

Language in which you want to receive the document.

Life cycle

NOW

WITHDRAWN
IEC 60249-3:1973 ED1
99.60 Withdrawal effective
Nov 19, 2016

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60249-3:1973/AMD1:1976 ED1




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