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IEC 60191-6-12:2002 ED1

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

Publication date:   Jun 14, 2002

General information

99.60   Withdrawal effective   Jun 8, 2011

IEC

TC 47/SC 47D

International Standard

31.080.01   Semiconductor devices in general

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Scope

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Life cycle

NOW

WITHDRAWN
IEC 60191-6-12:2002 ED1
99.60 Withdrawal effective
Jun 8, 2011

REVISED BY

PUBLISHED
IEC 60191-6-12:2011 ED2