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IEC 60191-3B:1978 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement IEC 60191-3B:1978 ED1

Publication date:   Jan 1, 1978

General information

99.60   Withdrawal effective   Oct 29, 1999

IEC

TC 47/SC 47D

International Standard

31.080.01   Semiconductor devices in general | 01.100.20   Mechanical engineering drawings

Buying

Revised

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Scope

Completes IEC 60191-3 by defining in a more satisfactory manner the mounted length and width of DIL and QUIL packages and giving recommendations for the bending of terminals of QUIL packages used for the mounting of integrated circuits. It also lists the dimensions permitting the definition of the families of packages of Form 3 and Form 4.

Life cycle

NOW

WITHDRAWN
IEC 60191-3B:1978 ED1
99.60 Withdrawal effective
Oct 29, 1999




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