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IEC 60068-2-69:1995 ED1

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method IEC 60068-2-69:1995 ED1

Publication date:   Dec 8, 1995

General information

99.60 Withdrawal effective   May 9, 2007

IEC

TC 91

International Standard

19.040   Environmental testing

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Revised

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Scope

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices.
The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Life cycle

NOW

WITHDRAWN
IEC 60068-2-69:1995 ED1
99.60 Withdrawal effective
May 9, 2007

CORRIGENDA / AMENDMENTS

ABANDON
IEC 60068-2-69/AMD1 ED1

REVISED BY

WITHDRAWN
IEC 60068-2-69:2007 ED2