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IEC 60068-2-58/AMD1/FRAGF ED4

Amendment 1 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) IEC 60068-2-58/AMD1/FRAGF ED4

General information

30.97   End of interruption of work - split/merged   Apr 1, 2022

IEC

TC 91

International Standard

19.040   Environmental testing | 31.190   Electronic component assemblies

Life cycle

NOW

ABANDON
IEC 60068-2-58/AMD1/FRAGF ED4
30.97 End of interruption of work - split/merged
Apr 1, 2022




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