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IEC 60068-2-54:2006 ED2

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Publication date:   Apr 27, 2006

General information

99.60 Withdrawal effective   Mar 7, 2017

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IEC

TC 91

International Standard

19.040   Environmental testing | 31.020   Electronic components in general

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Scope

IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: - the addition of lead free solder alloy (see Clause 7, Materials); - reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); - modification to the test requirement for progress of wetting (see Clause 9).

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60068-2-54:1985 ED1

NOW

WITHDRAWN
IEC 60068-2-54:2006 ED2
99.60 Withdrawal effective
Mar 7, 2017

REVISED BY

PUBLISHED
IEC 60068-2-69:2017 ED3