Gives information on the choice of solder and flux, temperature of test, ageing, as well as methods for the globule test, the solder bath test, the soldering iron test, solderability and de-wetting phenomena, resistance to soldering heat.
WITHDRAWN
IEC 60068-2-44:1979 ED1
99.60
Withdrawal effective
Jan 30, 1995
WITHDRAWN
IEC 60068-2-44:1995 ED2