IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.
WITHDRAWN
IEC 60068-2-20:1979 ED4
WITHDRAWN
IEC 60068-2-20:1979/AMD2:1987 ED4
WITHDRAWN
IEC 60068-2-20:1979/AMD1:1986 ED4
WITHDRAWN
IEC 60068-2-20:2008 ED5
99.60
Withdrawal effective
Mar 30, 2021
PUBLISHED
IEC 60068-2-20:2021 ED6