Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).
WITHDRAWN
IEC 60068-2-20:1968 ED3
WITHDRAWN
IEC 60068-2-20:1979 ED4
99.60
Withdrawal effective
Jul 21, 2008
WITHDRAWN
IEC 60068-2-20:1979/AMD2:1987 ED4
WITHDRAWN
IEC 60068-2-20:1979/AMD1:1986 ED4
WITHDRAWN
IEC 60068-2-20:2008 ED5