HD 555.21 S1:1990

Specifications for particular types of winding wires - Part 21: Solderable polyurethane enamelled round copper winding wire overcoated with polyamide, class 155 HD 555.21 S1:1990

Scope

This standard relates to solderable enamelled round copper winding wire of class 155 with a dual coating - The underlying coating is based on polyurethane resin which may be modified - The superimposed coating is based on polyamide resin (A modified resin is a resin that has undergone a chemical change or contains one or more additives to enhance certain performance or application characteristics - It should retain the essential chemical identity of the original resin and meet all specified wire requirements) - Class 155 is a thermal class that requires a minimum temperature index of 155 and a heat shock temperature of at least 175° C - The range of nominal conductor diameters covered by this standard is: Grade 1) 0,050 mm up to and including 1,600 mm - Grade 2) 0,050 mm up to and including 1,600 mm (The nominal conductor diameters are taken from IEC Publication 182-1)