EN ISO 9455-17:2024

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2024) EN ISO 9455-17:2024

Publication date:   Mar 18, 2024

General information

60.60   Standard published   Jan 17, 2024

CEN

CEN/TC 121 Welding and allied processes

European Norm

25.160.50   Brazing and soldering

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Scope

This document specifies a method of testing for deleterious effects that can arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes, as specified in ISO 9454-1, in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead (Sn/Pb) or Sn95,5Ag3Cu0,5 or other lead-free solders as agreed between user and supplier (see ISO 9453).
This test method is also applicable to fluxes for use with lead-containing and lead-free solders. However, the soldering temperatures can be adjusted with agreement between tester and customer.

Life cycle

PREVIOUSLY

WITHDRAWN
EN ISO 9455-17:2006

NOW

PUBLISHED
EN ISO 9455-17:2024
60.60 Standard published
Jan 17, 2024




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