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EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Publication date:   Jan 15, 2026

General information

60.60   Standard published   Nov 28, 2025

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).

This document is applicable to non-destructive testing of metallized holes.

Life cycle

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PUBLISHED
EN IEC 61189-3-302:2025
60.60 Standard published
Nov 28, 2025