0

EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) EN IEC 61189-3-302:2025

Publication date:   Jan 15, 2026

General information

60.60   Standard published   Nov 28, 2025

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

Buying

Published

Language in which you want to receive the document.

Scope

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).

This document is applicable to non-destructive testing of metallized holes.

Life cycle

NOW

PUBLISHED
EN IEC 61189-3-302:2025
60.60 Standard published
Nov 28, 2025




Access Genorma App Everywhere

Get fast and easy access to top European and International standards (EN, ISO, IEC) via your mobile phone, tablet or the web.

Google Play App Store Web Version