Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA
IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (<em>T</em><sub>d</sub>) of base laminate materials using thermogravimetric analysis (TGA).
Life cycle
NOW
PUBLISHED EN IEC 61189-2-807:2021 60.60
Standard published Oct 15, 2021