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EN IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA EN IEC 61189-2-807:2021

Publication date:   Feb 17, 2022

General information

60.60   Standard published   Oct 15, 2021

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

IEC 61189-2-807:2021 specifies a test method to determine the decomposition temperature (<em>T</em><sub>d</sub>) of base laminate materials using thermogravimetric analysis (TGA).

Life cycle

NOW

PUBLISHED
EN IEC 61189-2-807:2021
60.60 Standard published
Oct 15, 2021




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