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EN IEC 61189-2-804:2023

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 EN IEC 61189-2-804:2023

Publication date:   Feb 19, 2024

General information

60.60 Standard published   Oct 6, 2023

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

This International Standard specifies a test method to determine the time to delamination of base materials and printed boards using a thermomechanical analyzer (TMA). Temperatures used for this evaluation are typically 260 °C, 288 °C and 300 ºC, but are not limited to these values.

Life cycle

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PUBLISHED
EN IEC 61189-2-804:2023
60.60 Standard published
Oct 6, 2023