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EN IEC 61189-2-803:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards EN IEC 61189-2-803:2023

Publication date:   Dec 14, 2023

General information

60.60 Standard published   Sep 8, 2023

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

This International Standard specifies a test method to determine the Z-Axis Expansion of base materials and printed boards using a thermomechanical analyser (TMA).

Life cycle

NOW

PUBLISHED
EN IEC 61189-2-803:2023
60.60 Standard published
Sep 8, 2023