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EN IEC 61189-2-801:2023

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials EN IEC 61189-2-801:2023

Publication date:   Dec 14, 2023

General information

60.60   Standard published   Sep 8, 2023

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

This International Standard specifies a test method to be followed for Thermal Performance via carbon ink heating. The method employs a screened-on pattern of carbon ink used to determine the thermal performance of a dielectric layer on a metal base plate.

Life cycle

NOW

PUBLISHED
EN IEC 61189-2-801:2023
60.60 Standard published
Sep 8, 2023




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