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EN IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

Publication date:   Jul 15, 2021

General information

60.60 Standard published   Mar 12, 2021

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards | 31.190   Electronic component assemblies

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Scope

IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.

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PUBLISHED
EN IEC 61188-6-2:2021
60.60 Standard published
Mar 12, 2021