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EN IEC 60286-3:2022

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes EN IEC 60286-3:2022

Publication date:   Apr 18, 2023

General information

60.60 Standard published   Dec 23, 2022

CENELEC

CLC/SR 40 Capacitors and resistors for electronic equipment

European Norm

31.020   Electronic components in general | 31.240   Mechanical structures for electronic equipment

Buying

Published

Language in which you want to receive the document.

Scope

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Life cycle

PREVIOUSLY

PUBLISHED
EN IEC 60286-3:2019

NOW

PUBLISHED
EN IEC 60286-3:2022
60.60 Standard published
Dec 23, 2022