EN 61760-4:2015

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

Publication date:   Aug 17, 2015

General information

60.60 Standard published   Jul 3, 2015

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

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Scope

IEC 61760-4:2015 specifies the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling. It also extends the classification and packaging methods to such components, where currently existing standards are not required or not appropriate. For such cases this standard introduces additional moisture sensitivity levels and an alternative method for packaging.
This standard applies to devices intended for reflow soldering, like surface mount devices, including specific through-hole devices (where the device supplier has specifically documented support for reflow soldering), but not to semiconductor devices and devices for flow (wave) soldering.

Life cycle

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PUBLISHED
EN 61760-4:2015
60.60 Standard published
Jul 3, 2015

CORRIGENDA / AMENDMENTS

PUBLISHED
EN 61760-4:2015/A1:2018

REVISED BY

IN_DEVELOPMENT
prEN IEC 61760-4