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EN 61192-3:2003

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies EN 61192-3:2003

Publication date:   Aug 10, 2006

General information

99.60   Withdrawal effective   Apr 3, 2019

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

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Scope

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

Life cycle

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WITHDRAWN
EN 61192-3:2003
99.60 Withdrawal effective
Apr 3, 2019




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