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EN 61192-2:2003

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies EN 61192-2:2003

Publication date:   Aug 10, 2006

General information

99.60   Withdrawal effective   Apr 3, 2019

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

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Scope

Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

Life cycle

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EN 61192-2:2003
99.60 Withdrawal effective
Apr 3, 2019




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