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EN 61190-1-3:2007/A1:2010

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Publication date:   Nov 16, 2010

General information

99.60 Withdrawal effective   Jan 17, 2021

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.190   Electronic component assemblies

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EN 61190-1-3:2007

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EN 61190-1-3:2007/A1:2010
99.60 Withdrawal effective
Jan 17, 2021

REVISED BY

PUBLISHED
EN IEC 61190-1-3:2018