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EN 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Publication date:   Dec 17, 2013

General information

60.60 Standard published   Jun 28, 2013

CENELEC

CLC/SR 91 Electronics assembly technology

European Norm

31.180   Printed circuits and boards

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Scope

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Life cycle

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PUBLISHED
EN 61189-11:2013
60.60 Standard published
Jun 28, 2013