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EN 60749-22:2003

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

Publication date:   Dec 22, 2003

General information

60.60   Standard published   Jun 20, 2003

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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Scope

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements

Life cycle

NOW

PUBLISHED
EN 60749-22:2003
60.60 Standard published
Jun 20, 2003

REVISED BY

PUBLISHED
EN IEC 60749-22-1:2026

PUBLISHED
EN IEC 60749-22-2:2026