is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.
WITHDRAWN
EN 60539-2:2004
99.60
Withdrawal effective
Aug 23, 2022
WITHDRAWN
EN 60539-2:2004/A1:2010
PUBLISHED
EN IEC 60539-2:2019