EN 60286-3:2013

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Publication date:   Oct 14, 2013

General information

99.60 Withdrawal effective   Feb 20, 2022

CENELEC

CLC/SR 40 Capacitors and resistors for electronic equipment

European Norm

31.020   Electronic components in general | 31.240   Mechanical structures for electronic equipment

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Scope

IEC 60286-3:2013 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This standard also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This fifth edition cancels and replaces the fourth edition, published in 2007, as well as IEC 60286-3-1, published in 2009 and IEC 60286-3-2, published in 2009. It constitutes a full layout revision. In addition, this edition includes the following significant technical changes with respect to the previous edition: a) integration of IEC 60286-3-1:2009 as type 1b (Packaging of surface mount components on continuous pressed carrier tapes); b) integration of IEC 60286-3-2:2009 as type 2b (Packaging of surface mount components on blister carrier tapes 4 mm in width).

Life cycle

PREVIOUSLY

WITHDRAWN
EN 60286-3:2007

PUBLISHED
EN 60286-3-1:2009

PUBLISHED
EN 60286-3-2:2009

NOW

WITHDRAWN
EN 60286-3:2013
99.60 Withdrawal effective
Feb 20, 2022

CORRIGENDA / AMENDMENTS

WITHDRAWN
EN 60286-3:2013/AC:2013

REVISED BY

PUBLISHED
EN IEC 60286-3:2019