Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) EN 60191-6-3:2000
Publication date:
Nov 20, 2003
General information
60.60Standard publishedDec 4, 2000
CENELEC
CLC/SR 47D
Mechanical standardization of semiconductor devices