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EN 60191-6-22:2013

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) EN 60191-6-22:2013

Publication date:   May 17, 2013

General information

60.60 Standard published   Mar 15, 2013

CENELEC

CLC/SR 47D Mechanical standardization of semiconductor devices

European Norm

31.080.01   Semiconductor devices in general

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IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

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PUBLISHED
EN 60191-6-22:2013
60.60 Standard published
Mar 15, 2013