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EN 60191-6-21:2010

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Publication date:   Jan 21, 2011

General information

60.60 Standard published   Oct 15, 2010

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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Scope

IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.

Life cycle

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PUBLISHED
EN 60191-6-21:2010
60.60 Standard published
Oct 15, 2010