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EN 60191-6-17:2011

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Publication date:   Sep 21, 2011

General information

60.60 Standard published   Apr 15, 2011

CENELEC

CLC/TC 47X

European Norm

31.080.01   Semiconductor devices in general

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Scope

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Life cycle

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PUBLISHED
EN 60191-6-17:2011
60.60 Standard published
Apr 15, 2011