EN 60068-2-69:1996

Name: EN 60068-2-69:1996
Brand: CENELEC
SKU: EN 60068-2-69:1996
Price: 40.11 EUR
Availability: InStock
Rating: 4 (91 reviews)

Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

Publication date: Oct 31, 2006

General information

Current stage: 99.60 Withdrawal effective Jun 1, 2010

Originator: CENELEC

Owner: CLC/SR 91 Electronics assembly technology

Type: European Norm

ICS: 19.040 Environmental testing

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Status: Withdrawn

PDF - €40.11

Languages: English

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Scope

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices. The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Life cycle

NOW

WITHDRAWN
EN 60068-2-69:1996
99.60 Withdrawal effective
Jun 1, 2010

REVISED BY

WITHDRAWN
EN 60068-2-69:2007