99.60 Withdrawal effective Nov 22, 2000
CEN
CEN/TC 185 Fasteners
European Norm
21.060.10 Bolts, screws, studs
Withdrawn
This International Standard specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages.
This standard tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits (hereinafter both referred to as semiconductor devices) used mainly for industrial and consumer use equipment.
Legislation related to this standard
WITHDRAWN
EN 24016:1991
99.60
Withdrawal effective
Nov 22, 2000
WITHDRAWN
EN ISO 4016:2000
